Advanced Custom Packaging &
SiP Solutions Beyond Limits

(Advanced Custom Packaging & SiP Solutions)

Reco provides a one-stop, turn-key service from wafer-level processing and substrate-level assembly to final test and shipment. With high precision, advanced process control, and integration technologies, we deliver your next-generation products.

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Why Choose Reco?

One-Stop Turn-Key Service

From wafer processing and assembly to final test and shipment. Simplify supply chain management and shorten time-to-market.

High Precision & Reliability

Excellent voiding control and warpage management for higher yield and outstanding electrical performance.

Advanced Design & Integration

Advanced process integration and customized solutions to reduce cost and optimize performance for your applications.

Cooperation Process

Design & Simulation

Understand your product requirements and provide feasible solutions.

NPI / Prototyping

NPI using TCB, Die/Wire Bonding and molding for process validation.

Validation

AOI / SPI inspection and void/warpage control for quality assurance.

Mass Production& SiP T/K

Deliver reliable turn-key services with stable mass production.

Core Services & Technologies

01 Wafer Level Process

  • Wafer Taping
  • Grinding
  • Laser Grooving
  • Die Saw
  • DAF Attach (DAF Attach)

02 On Substrate Process

  • Warpage Control
  • Underfill Capillary Control

03 Wire Bonding

  • High Precision
  • Reliable Connection

04 Die Bonding

  • High Accuracy
  • Low Void Die Attach

05 TCB – Thermal Compression Bonding

  • High Accuracy
  • Better Warpage Control

06 SMT – Surface Mount Technology

  • High Precision Placement
  • Reflow Control
  • AOI / SPI

07 Molding / Encapsulation

  • Void Control
  • Warpage Control
  • Mold Materials for
  • High Reliability

08 Design & Simulation

  • Molding
  • Stress
  • Warpage
  • Thermal
  • Signal Integrity

09 SiP T/K Service

  • Complete Turn-key Solution
  • from Wafer to Module Level

10 Ultrasonic Technology

  • High sensitivity piezoelectric material
  • Low parasitic capacitance design
  • Robust encapsulation for harsh environments
  • High yield manufacturing process

Ready to Start Your Custom Packaging Project?