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Packaging service

iBGA & imBGA

Key Technology :
Dam & Fill, Cavity,Optical Alignment

PLCC

Key Technology :
J-Lead, High Reliability,Robust Structure

mPBGA

Key Technology :
Fine Pitch, High Density,Low Profile

LGA

Key Technology :
Land Grid Array,High Performance

FCCSP

Key Technology :
Flip Chip, Chip Scale,Compact & Cost-effective

FCBGA

Key Technology :
Flip Chip, High Density,Excellent Electrical Performance

SiP

Key Technology :
Turn-key Solution,System Integration,Miniaturization

MEMs

Key Technology :
Micro Fabrication,Wafer Level Packaging,High Reliability

Applications

Advanced packaging solutions that deliver performance, reliability,
and miniaturization across diverse industries.

Automotive

High-reliability packaging for next-generation vehicle electronics, ADAS, and in-vehicle connectivity.

Typical Applications
  • Advanced Driver Assistance Systems (ADAS)
  • Infotainment & Cockpit
  • Body & Safety Electronics
  • Powertrain & EV Control
  • Connectivity & V2X
Certifications
Consumer

Compact, high-performance packaging forsmart devices and connected lifestyles.

Typical Applications
  • Smartphones
  • Wearables (Smart Watch, TWS, AR/VR)
  • Audio & Visual Devices
  • Gaming & Handheld Devices
  • Smart Home & IoT Devices
Industrial

Rugged and reliable packaging for mission-critical industrial systems and automation.

Typical Applications
  • Industrial Automation & Robotics
  • Motor Drives & Power Electronics
  • Industrial Networking & Communication
  • Measurement & Test Equipment
  • Energy & Smart Grid