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FCBGA PACKAGE SOLUTION

Flip Chip, High I/O, High Performance & Thermal Management

FCBGA leverages flip chip interconnect technology with a large, high-density organic build-up substrate and advanced thermal solutions to deliver ultra-high I/O count, excellent electrical performance, and superior thermal management for high-performance applications.

FCBGA PROCESS FLOW
PACKAGE STRUCTURE (CROSS-SECTION)
KEY TECHNOLOGIES

  • Large Flip Chip Interconnect

    Ultra-high I/O count with low inductance and high performance.

  • High-Density Build-up Substrate

    Fine line/space multi-layer substrate for high routing density and power delivery.

  • Underfill Technology

    Enhances reliability, mechanical strength, and thermal cycling.

  • Thermal Management

    TIM and metal lid / heat spreader for efficient heat dissipation and high power & performance.

  • Ball Mount Technology

    High-precision ball placement and reflow ensure coplanarity and long-term reliability.

  • Reliability Assurance

    Comprehensive process control and material selection ensure high reliability for demanding applications.