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Technology

On Substrate Process

Key Technology : Warpage & Underfill Capillary Control

Wafer Level Process

Key Technology : Wafer taping, Grinding, Laser grooving, Die saw, DAF attach

SiP T/K Service

Key Technology : Turn-key solution from wafer to module level

SMT (Surface Mount Technology)

Key Technology : High Precision Placement, Reflow Control, AOI / SPI

Die Bonding

Key Technology : High Accuracy Placement, Low Void Die Attach

TCB (Thermal Compression Bonding)

Key Technology : High Accuracy, Better Warpage Control

Wire Bonding

Key Technology : High Precision Wire Bonding, Reliable Electrical Connection

Molding (Encapsulation)

Key Technology : Void Control, Warpage Control, High Reliability Encapsulation

Design & Simulation

Key Technology : Molding, Stress, Warpage, Thermal, Signal Integrity

Ultrasonic Technology

Key Technology : High SNR with low parasitic capacitance,
High robustness in harsh environment, Low power consumption,
Support large sensing area & various cover materials