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TCB (Thermal Compression Bonding) Process

Equipment
Suitable for assembly • Eutectic (Maximum temperature support 450°C)
• Large-area eutectic
Accuracy • X ; Y+/-2um, Θ +/-0.5° (depending on application)
Apply • COC / PD on TIA / DSP on PCB / VOD
Other • Placement pressure monitoring, real-time display 10-100g
• Substrate heating temperature can be set to a maximum of 200°C.
• The working area supports 10mm*10mm
• Pure nitrogen protection
• Temperature profile access
Equipment

  • High Temperature Capability

    Support up to 450°C for eutectic bonding

  • High Accuracy

    ±2µm placement accuracy and ±0.5° theta control

  • Precise Pressure Control

    Real-time pressure monitoring (10–100g)

  • Large Working Area

    Supports up to 10mm × 10mm bonding area

  • Process Stability

    Pure nitrogen protection for high reliability

  • Process Traceability

    Temperature profile monitoring and data access

Applications
  • COC / PD on
    TIA / DSP
  • High Performance
    Modules
  • Advanced
    Packaging