On Substrate Process
RECO proactively addresses known substrate-level failure modes through simulation-driven design and rigorous process control.
| Issue | Possible Root Cause | Corrective & Preventive Actions |
|---|---|---|
| Warpage | • CTE mismatch
• Molding non-uniformity • Structural asymmetry |
• Low CTE material
• Molding & warpage simulation • Thermal process tuning |
| BGA Ball Fatigue/Crack | • CTE mismatch
• Insufficient underfill protection |
• Low CTE material
• Underfill flow simulation • Underfill process optimization |
Warpage Simulation
Capillary Underfill Analysis
Critical Areas on Substrate
Process Flow (Key Controls)
