Process Flow
Key Points
- Protects wafer frontside
- High tape adhesion and flatness
- Minimize bubble and particle
Cross Section
Wafer-Level Process
RECO's wafer-level process capability is backed by best-in-class Disco and Nitto equipment — ensuring presise die preperation for advanced packaging.
1.Wafer Taping
2. Wafer Grinding / DAF Attach
Process Flow
Key Points
- Total Thickness Control
- High Parallelism and Surface Quality
- Strong DAF adhesion
Cross Section
3. Laser Grooving
Process Flow
Key Points
- High Accuracy Grooving
- Low Damage, Low Chipping
- Groove Depth and Width Control
Cross Section
4. Die Saw
Process Flow
Key Points
- High Precision Cutting
- Low Kerf Loss
- Clean Surface, Low Contamination
Cross Section
