Ultrasonic Technology
Advanced SiP solution integrates high performance ultrasonic sensor into compact module.
PRODUCT STRUCTURE
KEY TECHNOLOGIES
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High Sensitivity Piezoelectric Layer
High performance piezoelectric material for strong signal output and wide frequency response.
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Low Parasitic Capacitance Design
Optimized electrode and routing design to minimize parasitic capacitance for better SNR.
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Robust Encapsulation
Advanced molding protection for excellent durability under harsh environments (sweat/water/dust).
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Advanced Integration
Heterogeneous integration of Piezoelectric die and ASIC in compact SiP module.
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High Yield Manufacturing
Proven mass production process with strict quality control for high yield and reliability.
KEY PERFORMANCE
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FRR
< 1%
@ 1:50,000 FAR -
Latency
250ms(Include extreme condition)
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Sensing Area
Up to
20*30 mm -
Thickness
< 2.0 mm
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Operating Environment
-20°C ~ 70°C
0 ~ 95% RH
FINISHED PRODUCT
APPLICATIONS
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Smartphones
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Security
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Laptops
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Payment
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Wearables
