Design Capabilities
- Design for product and manufacturing (EE/ME)
- JEDEC-compliant package design experience
- Electronic circuit, fixture, and PKG design
- New process development for next-generation products
Electronic Circuit Design
Test Fixture Design
Package / Cross Section Design
Packaging Structure & Enclosure Design
From concept to manufacturable design
with optimized cost, performance, and reliability.
with optimized cost, performance, and reliability.
Simulation Capabilities
- First-time-right design through rapid structural and material verification.
Warpage Simulation
Stress Analysis (Cross Section)
Structural Analysis (Max Stress)
Thermal Analysis
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Multi-physics simulation ensures design robustness
and accelerates product development.
and accelerates product development.
Applications
- CIS / Image Sensor Module
- Optical / MEMS Devices
- Automotive Electronics
- Medical / Wearable Devices
- Industrial / IoT Modules
- High Performance Computing