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SiP

Ultra-Thin. Low Power. High Reliability.

Advanced SiP solutions delivering compact design, low power consumption, high reliability and exceptional user experience for next-generation devices.

PACKAGE FEATURES

  • Extremely Compact Design

    → Slim border & Z height for
    → space-constrained devices

  • Lower Power Consumption

    → Operation: 3mA
    → Idle: 7µA

  • Uncompromised ID Performance

    → Seamless metal frame/templates
    → Fancy design on deco layer

  • High Durability

    → Shock, vibration and drop resistant
    → Stable performance in harsh conditions

APPLICATION ADVANTAGES
PRODUCT HIGHLIGHTS
APPLICATIONS
Smartphones
Smart Glasses
Smart Rings

Extreme Miniaturization from PCBA to SiP Level

System in Package (SiP) integrates multiple functions into a single, compact module, delivering superior performance, smaller size and lower system cost.

KEY DESIGN FOR AR / VR SiP

DOUBLE-SIDE Tech.

Achieves 2x component density within the same footprint by utilizing vertical space.

LONG-STRIP SiP

Custom 6mm width modules engineered specifically for AR glasses temples.

SIZE COMPARISON
SiP ARCHITECTURE
SiP ADVANTAGE OF HETEROGENEOUS INTEGRATION

  • Reduced PCB layout size

    Significantly shrink board area and enable more compact system design.

  • Lower parasitic capacitance

    Improve signal integrity and high-speed performance.

  • Optimized power delivery network

    Enhance power efficiency and overall system stability.

TYPICAL MODULE COMPOSITION (EXAMPLE)