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iBGA / Slim iBGA / Slim imBGA

1 iBGA

STRUCTURE

Standard iBGA structure with full LES.
Provides robust protection for the image sensor.

FEATURES

  • Excellent mechanical strength
  • High reliability for harsh environments
  • Suitable for wide range of applications
2 Slim iBGA

STRUCTURE

Slim iBGA with reduced form factor.
Maintains full LES for reliability.

FEATURES

  • Smaller form factor for space savings
  • Strong protection and reliability
  • Good balance between form factor and performance
3 Slim imBGA

STRUCTURE

Slim imBGA with molding technology.
Minimal mold thickness for cost and yield advantage.

FEATURES

  • Lower cost through molding technology
  • Better yield and mass production efficiency
  • Good protection with optimized material usage
  • Ideal for high volume manufacturing