LGA PACKAGE SOLUTION
High Performance, Low Profile & Superior Reliability
LGA (Land Grid Array) packages provide excellent electrical performance, robust mechanical reliability, and outstanding thermal characteristics. With a flat bottom surface and high-density land pads, LGA is ideal for applications requiring high I/O count and excellent board-level reliability.
LGA PACKAGE PROCESS FLOW
PACKAGE STRUCTURE (CROSS-SECTION)
KEY TECHNOLOGIES
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High-Density Substrate
Multi-layer build-up substrate with fine line/space for high I/O and signal integrity.
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Exposed Land Pad
Flat bottom surface ensures optimal board contact and electrical performance.
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Wire Bond Technology
Reliable wire bonding for stable electrical connection.
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Molding Technology
High-quality mold compound for mechanical protection and reliability.
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Thermal Design
Optional exposed thermal pad for enhanced heat dissipation.
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Reliability Assurance
Comprehensive process control and testing for high reliability in demanding applications.