MEMS PACKAGE SOLUTION
Precision Packaging for Miniaturized Sensor Intelligence
MEMS packaging integrates miniature mechanical structures with advanced semiconductor and material technologies to deliver high precision, high reliability, and superior performance for sensing applications.
MEMS PACKAGE PROCESS FLOW
MEMS PACKAGE STRUCTURE (CROSS-SECTION)
KEY TECHNOLOGIES
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MEMS Integration
Precise handling of micro structures for optimal performance.
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Advanced Encapsulation
Protects sensitive MEMS structures from environment and stress.
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High-Precision Interconnect
Reliable wire bonding / RDL for stable signal transmission.
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High-Density Substrate
Compact, multi-layer substrate for miniaturization and performance.
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Reliability & Performance
Rigorous testing for long-term stability and accuracy.
