1Fine-Pitch Substrate
•Multi-layer BT substrate
•Fine line/space & microvia
•High routing density in compact size
mPBGA PACKAGE SOLUTION
High Density. High Performance. Compact Design.
mPBGA delivers high I/O count, excellent electrical performance,and cost-efficiency in a compact, thin profile for next-generation devices.
KEY TECHNOLOGIES
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2Wire Bonding
& Micro-Molding• Ultra-fine Au or Cu/PCC wire
• Low wire loop for thin profile
• Low-stress EMC molding for void-free encapsulation -
3Micro Solder Ball Array
• 0.5mm ~ 0.8mm pitch
• Smaller ball diameter
• Significant X-Y size reduction -
4Electrical
& Thermal Performance• Power/Ground planes for low parasitics & high SI
• Thermal vias & solder balls for efficient heat dissipation
mPBGA PACKAGE STRUCTURE
- Fine-pitch substrate with microvia and multi-layer routing
- Low wire loop & thin molding for ultra-thin profile
- Micro solder balls (0.5~0.8mm pitch) for compact form factor