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FCCSP PACKAGE SOLUTION

Flip Chip, Chip Scale, Compact & Cost-effective

FCCSP (Flip Chip Chip Scale Package) utilizes flip chip technology with solder bump interconnects to achieve high I/O density, excellent electrical performance, and compact form factor.

FLIP CHIP PROCESS FLOW
PACKAGE STRUCTURE (CROSS-SECTION)
KEY TECHNOLOGIES

  • Flip Chip Interconnect

    Solder bump interconnects provide high I/O density, low inductance, and superior electrical performance.

  • High-Density Substrate

    Advanced HDI or organic substrate with fine line/space routing for compact and high-performance design.

  • Underfill Technology

    Fills the gap between die and substrate to enhance reliability against thermal cycling and mechanical stress.

  • Fine-Pitch Solder Ball

    Small pitch solder balls (e.g., 0.3–0.5mm) enable chip scale package with excellent signal integrity.

  • Mold Protection

    Mold compound provides mechanical protection and environmental resistance.